The Ryzen AI 9 HX 370 model:family_text, developed by AMD engineers, expanded the range of desktop solutions :year_text. The die is produced using 4 nm technology. A motherboard with a compatible motherboards platform will be required for PC assembly. A hybrid design is employed here: 4 powerful cores handle heavy tasks, while 8 efficiency cores manage background processes. The total number of threads is 24. The base clock speed is 2 GHz. Automatic overclocking algorithms allow the chip to accelerate up to 5.1 GHz when the system demands it. Thanks to 16 MB of L3 cache, latency when accessing RAM is reduced. The TDP level for this model is set within 28 W. The gaming performance of Ryzen AI 9 HX 370 is at a high level. Architectural improvements and a spacious cache allow the system to rapidly process game engine physics.